crwdns2933423:0crwdne2933423:0

crwdns2933803:015crwdne2933803:0

crwdns2933797:0Walter Galancrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Walter Galan

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[* black] Notable ICs on the motherboard:
[* red] Toshiba [link|http://www.semicon.toshiba.co.jp/eng/product/memory/nand/mlc/emmc/|THGBMAG7A2JBAIR|new_window=true] 16 GB eMMC NAND Flash
[* orange] SKhynix H9TKNNNBPDAR RAM (we assume that the Snapdragon S4 Pro is also layered under this IC)
[* yellow] Qualcomm [link|https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-PM8921&viewState=DetailView&cartID=&g=&parentCategory=&navigationStr=CatalogSearchInc&searchText=pm8921|PM8921|new_window=true] Power Management IC
- [* green] Texas Instruments TMS320C55
+ [* green] Texas Instruments [link|http://www.ti.com/lsds/ti/dsp/c5000_dsp/overview.page|TMS320C55|new_window=true] Digital Signal Processor
[* blue] NXP 44701
[* violet] Skyworks [link|http://www.skyworksinc.com/Product.aspx?ProductID=1024|77619-12|new_window=true] Multiband Multimode Power Amplifier Module for Quad-Band GSM / EDGE and Penta-Band (Bands I, II, IV, V, VIII) WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE
[* black] Texas Instruments [link|http://www.ti.com/product/msp430f5259|MSP430 F5259|new_window=true] Mixed Signal Microcontroller