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[title] Reassembly information | |
- | [* icon_reminder] |
+ | [* icon_reminder] During reassembly, perform the following to clean the thermal paste: |
[* black] Use the flat end of a spudger to scrape off the thermal paste on the bottom of the logic board. | |
[* black] Clean any remaining thermal paste residue with isopropyl alcohol (>90%) and either a coffee filter or a lint-free cloth. | |
[* black] Repeat the cleaning process for the thermal paste on the frame. | |
- | [* icon_reminder] During reassembly, follow [guide|157417|this guide|new_window=true] |
+ | [* icon_reminder] During reassembly, follow [guide|157417|this guide|new_window=true] to reapply thermal paste to your device. |
[* icon_note] When applying new thermal paste, use the flat end of a spudger to spread it evenly across the logic board. Try to match the original spread. |