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| + | [title] Reassembly information |
|---|---|
| + | [* icon_reminder] During reassembly, perform the following to clean the thermal paste: |
| + | [* black] Use the flat end of a spudger to scrape off the thermal paste on the bottom of the logic board. |
| + | [* black] Clean any remaining thermal paste residue with isopropyl alcohol (>90%) and either a coffee filter or a lint-free cloth. |
| + | [* black] Repeat the cleaning process for the thermal paste on the frame. |
| + | [* icon_reminder] During reassembly, follow [guide|157417|this guide|new_window=true] to reapply thermal paste to your device. |
| + | [* icon_note] When applying new thermal paste, use the flat end of a spudger to spread it evenly across the logic board. Try to match the original spread. |
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