crwdns2933423:0crwdne2933423:0

crwdns2933803:013crwdne2933803:0

crwdns2933797:0Spencer Daycrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Spencer Day

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[title] Thermal paste information
[* green] Large globs of thermal paste and multiple thermal pads ***very strongly*** bond the heatsink to the logic board.
-[* icon_note] It will require significant force and constant pressure to detach the heatsink.
+[* icon_note] It will require significant force and constant pressure to detach the heatsink in the next two steps.