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crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA

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+[* black] After the solder balls are formed, clean with PCB cleaner. Apply Paste Flux to the bonding pads of the new screen.
+[* black] Align the chip of the original screen. Solder the chip with Hot Air Gun at 300 °C. Remove high-temperature tape after the flex cable has cooled.

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