crwdns2933803:08crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| + | [* black] Next, remove the chip on the original screen with the same method. |
|---|---|
| + | [* black] Clean tin on the chip of the original screen. Apply some middle-temperature Solder Paste to the bonding pads. Clean tin and black adhesive on the bonding pads of the chip with Solder Wick. Keep cleaning the bonding pads with PCB Cleaner. |
| + | [* black] Next, reball the chip. Put the reballing stencil in position. Apply a layer of middle-temperature Solder Paste evenly. |
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crwdns2915182:0crwdne2915182:0
crwdns2933777:02crwdne2933777:0
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crwdns2933777:03crwdne2933777:0
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