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crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA

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+[* black] Apply some Paste Flux to the bonding pads. Align the logic board with the signal board. Keep heating with the Heating Platform at 170 °C. Add heat around the motherboard with Hot Air Gun at 330 °C.

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