crwdns2933803:06crwdne2933803:0
crwdns2933797:0iRobotcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 iRobot
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| [* black] Since the heating platform for iPhone 13 Pro has not come out yet, we use a universal heating platform at 170 °C for separation. Because the middle layer of iPhone 13 lineup’s motherboard still uses middle-temperature Solder Paste for soldering. | |
| - | [* black] Add heat with Hot Air Gun at 330 °C around the motherboard, when the temperature of the Heating Platform reaches 150 °C. As the logic board becomes loose, remove the logic board with tweezers. |
| + | [* black] Add heat with Hot Air Gun at 330 °C around the motherboard, when the temperature of the Heating Platform reaches 150 °C. As the logic board becomes loose, remove the logic board with [product|IF145-020|tweezers]. |
| [* icon_caution] Be careful not to damage surrounding components while removing. | |
| [* black] The CPU is stacked with the baseband which is bad for motherboard heat dissipation. |