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| + | [* black] Since the heating platform for iPhone 13 Pro has not come out yet, we use a universal heating platform at 170 °C for separation. Because the middle layer of iPhone 13 lineup’s motherboard still uses middle-temperature Solder Paste for soldering. |
|---|---|
| + | [* black] Add heat with Hot Air Gun at 330 °C around the motherboard, when the temperature of the Heating Platform reaches 150 °C. As the logic board becomes loose, remove the logic board with tweezers. Please do not damage surrounding components while removing. |
| + | [* black] The CPU is stacked with the baseband which is bad for motherboard heat dissipation. |
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