crwdns2933803:05crwdne2933803:0
crwdns2933797:0gregkramercrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 gregkramer
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| + | [title] Under the hood |
|---|---|
| + | [* black] Removing the wireless charging bracket, we can see why the extra graphite is needed. All of the phones main components are neatly (and tightly) packed into half of the board. |
| + | [* black] And now we learn that the I.R. images I have of the phone during the thermal testing, are not high enough resolution to be shown here. (sorry). You just have to trust me when I say that there was a rather intense hot spot under the EMI can. |
crwdns2933777:01crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:02crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0