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| + | [* black] Apply some BGA Paste Flux to cylinders around the edge and get the upper layer in position. |
|---|---|
| + | [* black] Heat evenly with Hot Air Gun at 350℃, air flow 65. The soldering process is finished with the upper layer sinking and Paste Flux overflowing. |
| + | [* black] Wait for the motherboard to cool for 5 minutes. Now, let's assemble the phone and test. Go to Settings>Sounds&Haptics>Ringtone. Select a default ringtone, normal output sound this time. |
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