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crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
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| + | [* black] Clean with PCB Cleaner afterwards. Then apply some UV Curable Solder Mask to the soldered area. And solidify the upper layer under UV Dryer Lamp for 2 minutes. |
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| + | [* black] Then get the other end to the right position. Next, attach the lower layer to PCB Holder. Fix the BGA Reballing Stencil to the right position. Smear Soldering Paste evenly on the BGA reballing stencil with BGA Scraper. Wipe out excess Soldering Paste with lint-free wiping cloth. |
| + | [* black] Then heat evenly with Hot Air Gun at 350℃, air flow 35. So that all solder balls can solidify completely. Remove the BGA reballing stencil after 2 minutes. Heat again with Hot Air Gun to ensure the formation of solder balls. |
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