crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

crwdns2933803:015crwdne2933803:0

crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[* black] Then we recombine the motherboard. Put the signal board on the 165 °C Heating Platform to heat. Apply some Paste Flux to the bonding pad. Align the logic board with the signal board. When the temperature reaches 165 °C, detach the motherboard.
[* black] For better recombination, press two sides of the motherboard gently with tweezers.
-[* black] Then we power up the motherboard for testing. The current is normal. Connect the screen to test. The boot current is also normal. The current leakage problem has been fixed.
+[* black] Then we power up the motherboard for testing. The current is normal.