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crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
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+ | [* black] Then we recombine the motherboard. Put the signal board on the 165 °C Heating Platform to heat. Apply some Paste Flux to the bonding pad. Align the logic board with the signal board. When the temperature reaches 165 °C, detach the motherboard. |
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+ | [* black] For better recombination, press two sides of the motherboard gently with tweezers. |
+ | [* black] Then we power up the motherboard for testing. The current is normal. Connect the screen to test. The boot current is also normal. The current leakage problem has been fixed. |
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