crwdns2933803:03crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
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| + | [* black] With temperature of the platform reaching 155℃, pick up the upper layer with tweezers carefully. Tips: please be careful when separating the motherboard. |
|---|---|
| + | [* black] With solder balls on the third space PCB remaining the same, we can skip the reballing process when soldering the two layers back together. Attach the upper layer to the PCB Holder. Heat with Hot Air Gun at 280℃, air flow 3 to tear off the sticker. Continue heating to remove black adhesive around NAND. |
| + | [* black] Then heat with Hot Air Gun at 340℃, air flow 5. Pry up the NAND flash chip carefully. |
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