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| + | [* black] Put the signal board on the 160 °C Heating Platform to heat. After the solder balls are formed, cool the signal board. Apply some Paste Flux on the bonding pad. Align the logic board with the signal board. |
|---|---|
| + | [* black] Keep heating to recombine the motherboard. Remove the motherboard after heating for about 2 minutes. Connect the motherboard with a power cable after it has cooled. Trigger the boot-up with tweezers. The boot current jump is normal. |
| + | [* black] Then we install the motherboard. The phone can be turned on. IMEI number can also be seen. The fault has been cleared. |
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