crwdns2933803:04crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
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| + | [* black] Apply some Paste Flux to the bonding pad. Align the new USB IC. Heat to solder the USB IC with Hot Air Gun at 340 °C. Remove tin on the bonding pad with Soldering Iron at 365 °C and solder wick. Clean tin on the bonding pad of the signal board with the same method. Clean the bonding pad with PCB Cleaner. |
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