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| + | [* black] Attach the logic board to the holder. Apply some Paste Flux on the USB IC. Heat the USB IC with Hot Air Gun at 340 °C and airflow 3. Nudge the USB IC with tweezers while heating. Take out the USB IC if it becomes loose. |
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| + | [* black] Remove tin on the bonding pad with Soldering Iron at 365 °C and Hot Air Gun at 340 °C. Clean tin on the bonding pad again with solder wick. |
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