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crwdns2933803:02crwdne2933803:0

crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[* black] Connect the phone to the computer. Open 3uTools and view device details. 3uTools is unable to read data of the baseband version and Wi-Fi module.
[* black] Because the phone had no service after being dropped. It can be preliminarily judged that the pseudo-soldering of the middle layer may cause the trouble. Next, we need to separate the motherboard. Put the motherboard on the Heating Platform and peel off the foam.
+[* black] To make it easier to remove the logic board after separation, drive a screw on the logic board. Cut through the tape with a sculpture knife.