crwdns2933803:06crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| + | [* black] Put the signal board on the Heating Platform. Heat the signal board on the Heating Platform at 165℃. After the solder balls are formed, turn the power off and cool the motherboard for 5 minutes. Apply some Paste Flux. |
|---|---|
| + | [* black] Align the logic board with the signal board. Keep heating the motherboard on the 165℃ Heating Platform. When the temperature reaches 165℃, keep heating for 1 minute. This step is to ensure that the logic board and the signal board fit closely. Turn the power off and cool the motherboard for 5 minutes. Then remove the motherboard. |
crwdns2933777:01crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:02crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:03crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0