crwdns2933423:0crwdne2933423:0

crwdns2933803:06crwdne2933803:0

crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA

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crwdns2933771:0crwdne2933771:0
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+[* black] Use Hot Air Gun at 380℃ to heat the solder wick with soaked rosin to remove tin. Apply Paste Flux. Put a new USB IC in position. Solder with Hot Air Gun at 380℃. Clean with PCB Cleaner after the motherboard has cooled.

crwdns2933777:01crwdne2933777:0

crwdns2933779:0crwdne2933779:0

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