crwdns2933423:0crwdne2933423:0

crwdns2933803:05crwdne2933803:0

crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

+[* black] Remove thermal grease with a Sculpture Knife. Cover the CPU with the shielding cover and fix with high temperature tape. Remove black adhesive around the USB IC with Hot Air Gun at 280℃. Pry up the USB IC with Hot Air Gun at 380℃. Apply Paste Flux. Remove tin on the bonding pad with Soldering Iron at 365℃.

crwdns2933777:01crwdne2933777:0

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