crwdns2933803:04crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
+ | [* black] Apply some Solder Paste to the missing pads and apply tin with Hot Air Gun at 340 °C. Clean the bonding pad with PCB Cleaner and apply some Paste Flux. |
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+ | [* black] Solder 0.02 mm copper wires to the bonding pad with Soldering Iron. Please be noted that copper wires must be soldered firmly. |
+ | [* black] Clean with PCB Cleaner again and curl the copper wires to make pads with Tweezers and Sculpture Knife. |
crwdns2933777:01crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:02crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:03crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0