crwdns2933423:0crwdne2933423:0

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crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA

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+[* black] Apply some Solder Paste to the missing pads and apply tin with Hot Air Gun at 340 °C. Clean the bonding pad with PCB Cleaner and apply some Paste Flux.
+[* black] Solder 0.02 mm copper wires to the bonding pad with Soldering Iron. Please be noted that copper wires must be soldered firmly.
+[* black] Clean with PCB Cleaner again and curl the copper wires to make pads with Tweezers and Sculpture Knife.

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