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| + | [* black] Attach the signal board to the Reballing Platform. Put the reballing stencil in position to make sure that it is pressing against the signal board. |
|---|---|
| + | [* black] To prevent the solder paste from flowing into the motherboard gap, insert a metal plate. |
| + | [* black] Apply a layer of low-temperature Solder Paste and wipe off excess solder paste with a Lint-free Wipe. Remove the reballing stencil. Check if solder paste on the signal board is full. |
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