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[* black] Only the motherboard remains.
[* black] Follow this guide for more specifics on [guide|744|how to reapply thermal paste] to the processor.
-[* icon_reminder] A thick teal thermal compound bridges the gap between the shield plate and the heat sink. For best results, whenever the heat sink is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.
+[* icon_reminder] When you remove the heat sink, you’ll need to replace the thermal compound between the plate and the heat sink. Since normal thermal paste isn’t designed to bridge large gaps, the closest replacement is K5 Pro viscous thermal paste. You will, however, need normal replacement thermal paste for the APU.