crwdns2933423:0crwdne2933423:0

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crwdns2933797:0Jeff Suovanencrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Jeff Suovanen

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-[* black] And on the ~~even darker~~ rear side a huge copper plaster and these tiny electronics:
- [* red] [link|https://www.qualcomm.com/products/snapdragon-888-5g-mobile-platform|Qualcomm SM8350 Snapdragon 888 (5 nm)|new_window=true] LPDDR5 3200MHz with integrated X60 modem
- [* orange] SK Hynix-HN8T05BZGK-128GB flash memory chip UFS 3.1
+[* black] And on the ~~even darker~~ rear side, a huge expanse of copper conceals these tiny bits of silicon:
+ [* red] [link|https://www.qualcomm.com/products/snapdragon-888-5g-mobile-platform|Qualcomm SM8350 Snapdragon 888 (5 nm)|new_window=true] with integrated X60 modem, layered underneath LPDDR5 3200MHz
+ [* orange] SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1
[* green] Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC
- [* yellow] Qualcomm-SDR868-RF transceiver chip
- [* light_blue] Qualcomm-SMB1396-fast charging chip
- [* blue] Nuvolta-NU1619A-wireless power receiving chip
- [* violet] QORVO-QM77033D-front-end module chip
+ [* yellow] Qualcomm SDR868-RF transceiver chip
+ [* light_blue] Qualcomm SMB1396 fast charging chip
+ [* blue] Nuvolta NU1619A wireless power receiving chip
+ [* violet] Qorvo QM77033D front-end module