crwdns2933803:03crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| + | [* black] Remove black adhesive on the side of the NAND with a Side Glue Cleaner Blade. |
|---|---|
| + | [* black] Heat the NAND with Hot Air Gun at 385℃ and airflow 45. Pry up the NAND with a Pry Knife |
| + | [* black] Apply medium temperature solder paste to the bonding pad with Soldering Iron at 365℃. |
crwdns2933777:01crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:02crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:03crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0