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| + | [* black] After reballing, take the mold down from the base and remove the reballing stencil. Heat the lower layer on the heating platform at 165℃. Once solder balls have shaped up completely, power off the heating platform. |
|---|---|
| + | [* black] Cool for 5 minutes. Apply some BGA Paste Flux to the bonding pad and get the upper layer in position. |
| + | [* black] Then power on the heating platform. With the temperature reaching 165℃, continue heating for 2 minutes. |
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