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| + | [* black] Continue to place the lower layer to the heating platform. Power on the heating platform and set the temperature to 150℃. With solder paste melting, solder balls start to shape up. Once completed, power off the heating platform and wait for the lower layer to cool for 10 minutes. |
|---|---|
| + | [* black] Continue to apply BGA Paste Flux to the bonding pad. |
| + | [* black] Get the upper layer in position and power on the heating platform. |
| + | [* black] With the temperature of the platform reaching 150℃, continue heating for 1 minute. Once done, power off the heating platform. Wait for the motherboard to cool for 10 minutes. |
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