crwdns2933803:09crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
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| + | [* black] Clean with PCB Cleaner afterwards. |
|---|---|
| + | [* black] There is black adhesive around the bonding pad of U_PMIC_E. So we need to remove the black adhesive with tweezers before soldering. |
| + | [* black] Once done, apply Paste Flux to the bonding pad. Get a new U_PMIC_E in position and solder with Hot Air Gun at 330℃, air flow 3. |
| + | [* black] After that, clean with PCB Cleaner and tear off the High-temperature Tape. |
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