crwdns2933803:06crwdne2933803:0
crwdns2933797:0REWAcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 REWA
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| + | [* black] The phone goes with activation process. Click the icon at the bottom right corner. Serial number displays normally on the screen. No IMEI number on the screen. The phone shows a No Service error in the upper-right corner. We can confirm now that the bonding pad has not been pseudo soldered. The fault is related to the lower layer. |
|---|---|
| + | [* black] So we need to further check the lower layer. Run diode mode measurement of signal relevant pins on the bonding pad. Nothing goes wrong. |
| + | [* black] Continue to run diode mode measurement of capacitors related to the power supply circuit of U_PMIC_E. Nothing goes wrong. Judging by this, the fault is probably related to U_PMIC_E or U_MDM_E. |
crwdns2933777:01crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:02crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0
crwdns2933777:03crwdne2933777:0
crwdns2933779:0crwdne2933779:0
crwdns2915182:0crwdne2915182:0