crwdns2933803:012crwdne2933803:0
crwdns2933797:0Tarun Thirumacrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Tarun Thiruma
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crwdns2933807:0crwdne2933807:0
| [* black] With the motherboards removed we take a moment to admire the full cooling system. What a ''cool'' cookie sandwich. | |
| [* icon_note] The cream filling is thermal paste, which helps heat transfer through the layers. | |
| [* black] On the left: Fins pull heat from the copper plate/vapor chamber to be wicked away by cool air. | |
| [* black] Next up—Along with the copper plate, this metal frame acts as an EM shield, it also transfers heat from the power MOSFETS via thermal pad. | |
| - | [* black] The "CCS" (that's "Center Chassis")—provides rigidity, sinks heat, and maximizes board coolification. |
| + | [* black] The "CCS" (that's "Center Chassis")—provides rigidity, aids in shielding, sinks heat, and maximizes board coolification. |
| [* black] Finally on the end, a Faraday-cage-like EM shield protects the other motherboard while allowing air to cycle through. |