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crwdns2933797:0Sam Goldheartcrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Sam Goldheart

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[* black] With the motherboards removed we take a moment to admire the full cooling system. What a ''cool'' cookie sandwich.
[* icon_note] The cream filling is thermal paste, which helps heat transfer through the layers.
-[* black] On the left: the finned heat sink. They transfer heat up from the copper plate/vapor chamber to be wicked away by cool air.
-[* black] Next up—a metal frame. Combined with the copper plate, it acts as an EM shield for the motherboard. There's a thermal pad that transfers heat from the row of power MOSFETS on the motherboard to the frame.
+[* black] On the left: Fins pull heat from the copper plate/vapor chamber to be wicked away by cool air.
+[* black] Next up—Along with the copper plate, this metal frame acts as an EM shield, it also transfers heat from the power MOSFETS via thermal pad.
[* black] The "CCS" (that's "Center Chassis")—provides rigidity, sinks heat, and maximizes board coolification
-[* black] Finally on the far right, a Faraday-cage-like EM shield to protects the other motherboard while allowing air to cycle through.
+[* black] Finally on the end, a Faraday-cage-like EM shield protects the other motherboard while allowing air to cycle through.