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crwdns2933797:0Taylor Dixoncrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Taylor Dixon

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[* black] And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog:
[* red] Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM
[* orange] 128 GB Toshiba UFS 3.0 storage
- [* yellow] Qorvo 78052 RF Fusion MHB front-end module
+ [* yellow] Qorvo 78052 [document|24716|RF Fusion] MHB front-end module
[* green] Microsoft X904163 display driver
[* light_blue] Qualcomm SDR8150 LTE Transceiver
[* blue] Qualcomm [https://www.qualcomm.com/products/wcd9340|WCD9340|new_window=true] audio codec
[* violet] Qualcomm PM8150 power management ICs