crwdns2933803:08crwdne2933803:0
crwdns2933797:0Tarun Thirumacrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Tarun Thiruma
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| [* black] And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog: | |
| [* red] Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM | |
| [* orange] 128 GB Toshiba UFS 3.0 storage | |
| - | [* yellow] Qorvo 78052 RF Fusion MHB module |
| + | [* yellow] Qorvo 78052 [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] MHB front-end module |
| [* green] Microsoft X904163 display driver | |
| [* light_blue] Qualcomm QPM4621 power amplification module | |
| [* blue] Qualcomm [https://www.qualcomm.com/products/wcd9340|WCD9340|new_window=true] audio codec | |
| [* violet] Qualcomm PM8150 power management ICs |