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crwdns2933797:0CChincrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Jeff Suovanen
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[* black] Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find: | |
[* red] A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC | |
[* icon_note] The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on [https://www.systemplus.fr/foplp-vs-fowlp-the-battle-between-two-giants-samsung-and-tsmc/|getting as much tech in the tiniest package|new_window=true]—which was already used in the original Galaxy Watch. | |
[* orange] S915 SBN3K Intermediate Frequency IC | |
[* yellow] NXP 80T17 NFC controller | |
[* green] [https://www.broadcom.com/products/wireless/wireless-lan-bluetooth/bcm4313|Broadcom BCM430132|new_window=true] WiFi/Bluetooth module and [https://www.broadcom.com/products/wireless/gnss-gps-socs/bcm47755|Broadcom GNSS Location Hub|new_window=true] for GPS/GLONASS/etc | |
- | [* light_blue] Qualcomm QPA5580 |
+ | [* light_blue] Qualcomm Atheros QPA5580 |
[* blue] IDT P9222S wireless power receiver |