crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

crwdns2933803:08crwdne2933803:0

crwdns2933797:0Gabriel Redercrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Gabriel Reder

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

-[* black] Bend the heating pad back and holding it between the heating pad and the chip apply light pressure that will help to separate the two components.
-[* icon_caution] Warning high risk of burning your fingers. Make sure to watch the heating iron and the molten solder.
-[* black] When ready start heating the top pin until it is liquefied and pull the pin out. Repeat for second pin
+[* black] Bend the heating pad back while applying light pressure to the chip to assist separating the two components.
+[* icon_caution] Warning: There is a high risk of burning your fingers so please make sure to use proper protection such as gloves.
+[* black] Start heating the top pin until it is liquefied and are able to detach the pin. Repeat this process for the second pin.