crwdns2933803:07crwdne2933803:0
crwdns2933797:0Jeff Suovanencrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Jeff Suovanen
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| + | [* black] The Flip packs a dense, double-stacked motherboard—known in the industry as a [https://www.quick-pcba.com/pcb-news/substrate-like-pcb-technology.html|substrate-like PCB|new_window=true]. We first saw this space-saving technology in the [guide|98975|iPhone X|stepid=182892|new_window=true], and more recently in the [guide|125590|Note10|stepid=242798|new_window=true]. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space: |
|---|---|
| + | [* red] Samsung 925 K3UH7H7 (likely 8 GB of RAM layered on top of the Snapdragon 855 CPU) |
| + | [* orange] Samsung 949 KLUEG8UHDB (likely the 256 GB of flash storage) |
| + | [* yellow] Broadcom AFEM-9106 front-end module |
| + | [* green] Skyworks 78160-51 low noise amplifier |
| + | [* light_blue] Qualcomm SDR8150 RF transceiver |
| + | [* blue] Qualcomm WCN3998 WiFi + Bluetooth SoC |
| + | [* violet] NXP 80T17 NFC controller |
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