crwdns2933803:09crwdne2933803:0
crwdns2933797:0Taylor Dixoncrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Taylor Dixon
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| - | [* black] Thermal pads aside, let's get to those chips! On the front side of these motherboards (top: S10e, bottom: S10), we spot: |
|---|---|
| + | [* black] Thermal pads and cameras aside, let's get to those chips! On the front side of these motherboards (top: S10e, bottom: S10), we spot: |
| [* red] S10e: 128 GB [https://business.toshiba-memory.com/en-us/product/memory/mlc-nand/ufs.html|Toshiba|new_window=true] UFS NAND flash storage | |
| [* red] S10: 512 GB [https://www.samsung.com/semiconductor/estorage/eufs/KLUFG8R1EM-B0C1/|Samsung|new_window=true] eUFS NAND flash storage | |
| [* orange] Samsung [https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM] LPDDR4X layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC | |
| [* yellow] Qualcomm [https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec | |
| [* green] Qorvo 78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module | |
| [* light_blue] Maxim MAX77705C PMIC | |
| [* blue] Skyworks 78160-5 |