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crwdns2933797:0Taylor Dixoncrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Taylor Dixon
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| [* black] Before we can get a look at what makes these phones tick, we dispose of the curious new thermal pad covering the large shields below the SIM tray. | |
| - | [* icon_note] |
| + | [* icon_note] This pad most likely pulls double duty, both enhancing the copper heat pipe's ability to manage the heat coming off the hot chips, and performing some RF shielding. |
| [* black] Thermal pads aside, let's get into the good stuff. On the front side of these motherboards (top: S10e, bottom: S10), we spot: | |
| [* red] Maxim MAX77705C (probably a PMIC) | |
| [* orange] S10e: 128 GB [https://business.toshiba-memory.com/en-us/product/memory/mlc-nand/ufs.html|Toshiba|new_window=true] UFS NAND flash storage | |
| [* orange] S10: 512 GB [https://www.samsung.com/semiconductor/estorage/eufs/KLUFG8R1EM-B0C1/|Samsung|new_window=true] eUFS NAND flash storage | |
| [* yellow] Samsung [https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM] LPDDR4X layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC | |
| [* green] Qualcomm [https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec |