crwdns2933803:07crwdne2933803:0
crwdns2933797:0Arthur Shicrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Arthur Shi
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
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crwdns2933807:0crwdne2933807:0
| [* black] Taking a peek beneath the motherboard, we make a couple ''cool'' observations: | |
| [* black] There's a massive copper heat pipe running alongside the battery. It's a whole lot wider than [https://d3nevzfk7ii3be.cloudfront.net/igi/CiZqQr3PttPN1NeB.huge|last year's|new_window=true], probably to help with the extra heat coming off the wireless charging coils. | |
| [* black] Up against the copper heat pipe on the motherboard is a new thermal management pad. There must be something important going on under there! | |
| - | [* black] Removing the cameras we spy some yellow plastic housing that looks distinctly 80's. Could it be some kind of retro shock absorber? |
| - | [* black] The S10 gets one more camera than the S10e—a telephoto—and sticks it on the same connector as the wide-angle camera. |
| - | [* icon_note] This year's codename is "Beyond" an upgrade from last year's ~~infinity~~ "[guide|104308|Star|stepid=195677|new_window=true]". |
| + | [* black] Before we can get a look at what makes these phones tick, we dispose of the curious new thermal pad covering the large shields below the SIM tray. |
| + | [* icon_note] This pad most likely pulls double duty, both enhancing the copper heat pipe's ability to manage the heat coming off the hot chips, and performing some RF shielding. |