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crwdns2933797:0Patrick Bennettcrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Patrick Bennett

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-[* black] Wedge a plastic opening tool under the bottom of the circuit board and push upward to separate the circuit board from the back of the phone.
+[* black] Wedge a plastic opening tool under the bottom of the circuit board and push upward to separate the circuit board from the back of the phone. Be careful to not break the circuit board as it is connected to the hinge.