crwdns2933803:03crwdne2933803:0
crwdns2933797:0Kyle Smithcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Kyle Smith
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| [* black] Insert a spudger underneath the shield plate along the edge of the device. | |
| [* icon_reminder] Pry up to lift the shield plate up. | |
| [* icon_note] You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste. | |
| - | [* icon_note] If you weren't able to peel the foam pad in the previous step, it will prevent you from completely lifting up the shield plate. After detaching the plate from the heatsink, carefully separate the plate from the foam pad. |
| [* black] Remove the shield plate. | |
| [* icon_reminder] A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the old thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true] during reassembly. |