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[* black] Insert a spudger underneath the shield plate along the edge of the device.
[* icon_reminder] Pry up to lift the shield plate up.
[* icon_note] You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.
[* black] Remove the shield plate.
-[* icon_reminder] Clean off the old thermal paste from the shield plate and heat sink using high-concentration (90% or higher) isopropyl alcohol and a microfiber cloth. [guide|744|Apply new thermal paste|new_window=true] to the heat sink before reassembly.
+[* icon_reminder] A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the old thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true] during reassembly.