crwdns2933803:014crwdne2933803:0
crwdns2933797:0David Hodsoncrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 David Hodson
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
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crwdns2933807:0crwdne2933807:0
| [* black] The Murata Wi-Fi SoC module actually comprises a Broadcom BCM4334 package in addition to an oscillator, capacitors, resistors, etc. | |
| - | [* black] Apple assembles all of the components together and sends their package to Foxconn, where it eventually ends up on the iPhone. Chipworks said it best: "Murata makes a house that is full of other people's furniture." |
| + | [* black] Apple assembles all of the components together and sends their package to Foxconn, where it eventually ends up on the iPhone's logic board. Chipworks said it best: "Murata makes a house that is full of other people's furniture." |
| [* black] Here are the die images for the Broadcom BCM4334, fabricated in Taiwan at [http://en.wikipedia.org/wiki/TSMC|TSMC] on a 40 nm CMOS process. Its key features: | |
| [* red] Wi-Fi (802.11 a/b/g/n) | |
| [* orange] Bluetooth 4.0! |