crwdns2933803:015crwdne2933803:0
crwdns2933797:0TechGeos1019crwdnd2933797:0crwdne2933797:0
crwdns2936045:0crwdne2936045:0 crwdns2933505:0crwdne2933505:0 Jeff Suovanen
- crwdns2933769:0crwdne2933769:0
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[* black] More chips on the underside of the logic board: | |
[* red] Qualcomm PM8018 RF power management IC | |
- | [* yellow] Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash |
+ | [* yellow] Hynix H2JTDG2MBR (or Toshiba THGBX26702JLA01) 128 Gb (16 GB) NAND flash* |
[* orange] Apple 338S1131 dialog power management IC* | |
[* green] Apple 338S1117 Cirrus Logic Class D Amplifiers. The die inside is a Cirrus Logic device (second image) but it does not look like the audio codec. | |
[* blue] STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones | |
[* violet] Murata 339S0171 (based on Broadcom BCM4334) Wi-Fi module |