crwdns2933423:0crwdne2933423:0

crwdns2933803:011crwdne2933803:0

crwdns2933797:0CChincrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Adam O'Camb

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[* black] The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.
[* black] Chipwise, we spy:
[* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)
[* orange] Toshiba THGBX4G7D2LLDYC 16 GB NAND flash
[* yellow] USI 339S00450 WiFi/Bluetooth module, likely with a [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|Broadcom BCM43572 trapped inside|new_window=true]
- [* green] Apple/Dialog [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
+ [* green] Apple/Dialog Semiconductor [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
[* black] Interestingly, [https://d3nevzfk7ii3be.cloudfront.net/igi/UYNZVyo2AiAL1djs|the reverse|new_window=true] has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?