crwdns2933803:011crwdne2933803:0
crwdns2933797:0Claire Mieschcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Claire Miesch
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| [* black] The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board. | |
| [* black] Chipwise, we spy: | |
| [* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM layered underneath | |
| [* orange] Toshiba THGBX4G7D2LLDYC 16 GB NAND flash | |
| - | [* yellow] USI 339S00450 WiFi/Bluetooth module, likely with a [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|Broadcom BCM43572 trapped inside|new_window=true] |
| + | [* yellow] USI 339S00450 WiFi/Bluetooth module, likely with a [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|Broadcom BCM43572 trapped inside|new_window=true] |
| [* green] Apple/Dialog [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC | |
| [* black] Interestingly, [https://d3nevzfk7ii3be.cloudfront.net/igi/UYNZVyo2AiAL1djs|the reverse|new_window=true] has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes? |