crwdns2915892:0crwdne2915892:0
This is a prerequisite-only guide! This guide is part of another procedure and isn't meant to be used alone.
crwdns2942213:0crwdne2942213:0
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Insert a SIM eject tool, bit, or straightened paperclip into the SIM card tray hole on the left edge of the phone.
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Push the SIM eject tool into the hole to eject the SIM card tray.
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Remove the SIM card tray.
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Heat an iOpener and apply it to the back cover's right edge for two minutes.
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Flip your phone over so the display is facing up.
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Apply a suction handle to the middle of the display's left edge, as close to the edge as possible.
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Place the tip of an opening pick in the small gap between the back cover and the display.
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Pull up on the suction cup with a strong, steady force and push the opening pick down at a 45 degree angle until it slides into the gap between the back cover and the display.
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Slide the pick along the left edge down to the bottom left corner, and then up to the top left corner, to release the clips and slice the adhesive.
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Leave the pick inserted in the top left corner to prevent the adhesive from resealing.
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Flip your phone over and apply a heated iOpener to the back cover's top edge for two minutes.
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Flip your phone over and rotate the pick around the top left corner.
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Slide the pick along the top edge to release the clips and slice the adhesive.
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Leave the pick inserted in the top right corner.
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Flip your phone over and apply a heated iOpener to the back cover's left edge for two minutes.
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Flip your phone over and rotate the pick around the top right corner.
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Slide the pick along the right edge to release the clips and slice the adhesive.
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Leave the pick inserted in the bottom right corner to prevent the adhesive from resealing.
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Flip your phone over and apply a heated iOpener to the back cover's bottom edge for two minutes.
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Flip your phone over and rotate the pick around the bottom right corner.
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Slide the opening pick along the bottom edge to release the clips and slice the adhesive.
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Flip your phone over and apply a heated iOpener to the fingerprint sensor on the back cover for two minutes.
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Press down on the fingerprint sensor with the flat end of a spudger or your finger.
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While pressing down on the fingerprint sensor, gently pull up the bottom edge of the back cover until the sensor detaches.
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Lift the back cover up and remove it.
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This is a good point to test your phone's functionality before sealing it up. Use this guide to run a hardware test. Be sure to power your phone back down completely before you continue working.
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Apply new adhesive to the perimeter of the underside of the back cover after cleaning the relevant areas with isopropyl alcohol (>90%) and a micro-fiber cloth.
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Insert the flat end of a spudger under the fingerprint sensor.
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Gently pry up and detach the fingerprint sensor from the motherboard cover.
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Use a Phillips screwdriver to remove the seven 3.9 mm screws securing the motherboard cover.
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Insert the flat end of a spudger in the gap between the frame and the bottom left corner of the motherboard cover.
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Lift straight up with the spudger to release the clips securing the motherboard.
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Pull the motherboard cover towards the top of the phone to remove it.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
