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The thermal paste is usually replaced in conjunction with the cooling fan. Therefore it is a good idea to replace the thermal paste while the laptop is being disassembled to save time.
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Ground yourself by either touching an unpainted metal surface or by using the Anti-Static wrist strap.
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Turn off the computer and remove the charger from the charging port.
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Turn the laptop over and slide the battery release catch to the right. The battery will pop up from its slot. Remove it using your fingers.
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Use a Phillips #0 screwdriver to remove the four screws from the indicated cover.
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Gently lift and remove the cover.
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Remove the five 6mm screws with the Phillips #0 screwdriver.
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Pry the keyboard off with a spudger. Be careful not to apply too much pressure and damage any components.
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Disconnect the clip attaching the keyboard wiring to the motherboard. Lift and remove the keyboard.
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Use a Phillips #0 screwdriver to remove the 6mm screw from the top panel.
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Gently lift and remove the panel. Use a metal spudger if the it seems set in place.
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Use a Phillips #0 screwdriver to remove the 6mm screw for the Wi-Fi module cover.
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Remove the cover.
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Remove all fourteen 6mm screws using a Phillips #0 screwdriver.
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Partially separate the two panels until connectors are visible.
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Unclip the wires that attach the trackpad module to the motherboard.
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Remove the five highlighted screws using a Phillips #0 screwdriver.
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Disconnect the five cables by gently pulling them from their slots.
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Press a metal spudger between the VGA port and the plastic housing to pry up the motherboard.
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Remove the motherboard and turn it so that the fan is facing upward.
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Use a Phillips #0 screwdriver to loosen the three screws attaching the heatsink to the motherboard.
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Remove the heatsink and fan assembly by unclipping the fan from the motherboard.
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Gently wipe the thermal paste off of the processor and heatsink using an alcohol pad or damp cloth. Let the components dry for a few minutes.
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Apply a pea sized amount of thermal paste to the processor and heatsink. Keep the paste thick to prevent forming air bubbles and reducing thermal performance.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
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UC Davis, Team 2-3, Oliver Fall 2016 crwdns2935289:0UC Davis, Team 2-3, Oliver Fall 2016crwdne2935289:0
UCD-OLIVER-F16S2G3
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